Computational Modeling of Extracellular Matrix Protein Stamping on Hard Substrates for Biomedical Micro-Devices.

Abstract

We model the direct transfer of ECM protein to hard substrates that are relevant to biomedical micro devices. To better understand the processes involved in the contact and transfer of protein, mechanics model and finite element simulations were used to simulate the protein transfer process over hard substrates with different stamped–strike layer thickness ratios. We also considered the direct transfer of the ECM protein to bare substrates.  Interfacial fracture analyses are used to determine the minimum stamping pressure required for direct transfer. A conservative model is also presented for the stamping of ECM protein on hard substrate. This provides the opportunity for better designs of new stamps and optimization of existing ECM Stamps

Keywords: ECM Protein, stamp, Substrates.